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3D Integration in VLSI Circuits: Implementation Technologies and Applications (Devices, Circuits, and Systems)

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Description:Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world's leading scientists and experts from academia, research institutes, and industry from around the globe.We have made it easy for you to find a PDF Ebooks without any digging. And by having access to our ebooks online or by storing it on your computer, you have convenient answers with 3D Integration in VLSI Circuits: Implementation Technologies and Applications (Devices, Circuits, and Systems). To get started finding 3D Integration in VLSI Circuits: Implementation Technologies and Applications (Devices, Circuits, and Systems), you are right to find our website which has a comprehensive collection of manuals listed.
Our library is the biggest of these that have literally hundreds of thousands of different products represented.

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ISBN: 1138710393

Description: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world's leading scientists and experts from academia, research institutes, and industry from around the globe.We have made it easy for you to find a PDF Ebooks without any digging. And by having access to our ebooks online or by storing it on your computer, you have convenient answers with 3D Integration in VLSI Circuits: Implementation Technologies and Applications (Devices, Circuits, and Systems). To get started finding 3D Integration in VLSI Circuits: Implementation Technologies and Applications (Devices, Circuits, and Systems), you are right to find our website which has a comprehensive collection of manuals listed.
Our library is the biggest of these that have literally hundreds of thousands of different products represented.

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3D Integration in VLSI Circuits: Implementation Technologies and Applications (Devices, Circuits, and Systems)

3D Integration in VLSI Circuits: Implementation Technologies and Applications (Devices, Circuits, and Systems)

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